Analysis of Solder Joint with Copper Pad UBM in Electronic Packages - a Fracture Mechanics Approach. Journal of Manufacturing Engineering, [S. l.], v. 3, n. 3, p. 172–177, 2008. Disponível em: https://smenec.org/index.php/1/article/view/639. Acesso em: 16 oct. 2024.