A COMPUTATIONAL MODEL TO PREDICT MATERIAL REMOVAL DEPTH IN WIRE-EDM OF SILICON WAFERS SLICING. Journal of Manufacturing Engineering, [S. l.], v. 18, n. 4, p. 136–140, 2023. DOI: 10.37255/jme.v18i4pp136-140. Disponível em: https://smenec.org/index.php/1/article/view/549. Acesso em: 16 oct. 2024.