EFFECT OF BONDING PRESSURE ON MECHANICAL AND METALLURGICAL CHARACTERISTICS OF POWDER METALLURGICALLY PRODUCED PURE ALUMINIUM AND PURE COPPER JOINTS
Keywords:
Pure Aluminium, Pure copper, Powder Metallurgy, Diffusion bondingAbstract
In this investigation, pure aluminium (Al) and pure copper plates manufactured by powder metallurgy (P/M) technique were bonded by diffusion bonding process. The selection of diffusion bonding process variables that influence interfacial structure, morphology and compound is critical to obtain the quality of bonds. The experiments were conducted by varying the pressure between 2-20 MPa and the bonding temperature and the holding time were kept constant. The bonding quality was checked by microstructure analysis near the diffusion bonding interface using optical microscope (OM). The shear strength and bonding strength of the bonds were evaluated by conducting lap shear test and ram tensile test respectively. These strengths of the bonds are getting enhanced by applying process parameters. However, the effect of bonding pressure on diffusion bonding of powder metallurgically produced pure aluminium and pure copper was analysed in details.
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