NOVAL ATOMIC LAYER DEPOSITION FOR ADVANCED TUGSTEN NUCLEATION LAYER FOR NANO STRUCTURES

Authors

  • Jagadeesha T AIT, Chikmagalur
  • Daping Yao Process Engineer,Applied Materials, Singapore,
  • Kimberly Branshaw Section Manger-CVD,CSM Technologies, Singapore
  • Louis Kim Section Manger-CVD,CSM Technologies, Singapore

Keywords:

Nucleation layer, CVD, W deposition, CVD Film

Abstract

As the contact size shrinks below 0.13 micron with high aspect ratio, the conventional CVD W can not achieve compete fill due to inadequate step coverage of nucleation process. Thin film of W grown by atomic layer deposition (ALD) with WF6 and B2H6 chemistry technique, on the other hand, shows 100% step coverage confirmed by TEM. It can be applied as an advanced nucleation layer for CVD W deposition. In this paper, we discuss process development for 300mm ALD W chamber and present film characterization results

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References

T. Suntola, Thin Sold Films, 216, 84 (1992)

J.W. Klaus, A.W. Ott, A.C. Dillon and S.M George, Surf. Science., 418, L14 (1998)

A.W. Ott, J.W. Klaus, J.M. Johnson and S.M George, Thin Sold Films, 292, 135 (1997)

J.W. Klaus, S.J Ferro and S.M George, Applied. Surface. Science, 162, 479 (2000)

Hichem M’saad, Manoj Vellaikal. Integration of HDP-FSG as ILD materials in multilevel interconnect devices. DUMIC catalogue #999IMIC-444D (1999), 210-220.

T. Suntola, "Atomic Layer FSG", Materials Science Reports, Volume 4, number 7, December 1989, 0920-2307/89, Elsevier Science Publishers B.V

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Published

2009-03-01

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Section

Articles

How to Cite

[1]
“NOVAL ATOMIC LAYER DEPOSITION FOR ADVANCED TUGSTEN NUCLEATION LAYER FOR NANO STRUCTURES”, JME, vol. 4, no. 1, pp. 69–72, Mar. 2009, Accessed: Dec. 22, 2024. [Online]. Available: https://smenec.org/index.php/1/article/view/609

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